JYF-F1412B-RT301 JYF P12+S14 card edge connector Power supply Pin 51.5A; Signal Pin 3A;

Product Overview

Material: Insulator: High temperature resistant thermoplastic, UL94-V0, black; Terminal: High performance copper alloy, contact area gold-plated, pins misted with tin; Fixed feet: High performance copper alloy, surface tin plated; Material: Insulator: High temperature resistant thermoplastic, UL94-V0, black; Terminal: High performance copper alloy, contact area gold-plated, pins misted with tin; Electrical performance: Rated current: Power supply Pin 51.5A; Signal Pin 3A; Voltage withstand: 1000V DC power supply terminal has no breakdown for 1 minute; 500V DC signal terminal has no breakdown for 1 minute; Contact impedance: Power terminal ≤ 0.6m Ω; Signal terminal ≤ 25 m Ω; Insulation resistance: 5000 MEG OHM MIN power terminal; 500 MEG OHM MIN signal terminals; Working temperature: -55 ℃~105 ℃ Product Application Contact Pitch is 2.54mm, contact tail: through hole, mating with 1.60±0.20mm thickness PCB gold finger, used in the PCB connection of communications equipment, precision instrument，computer etc. Work environment Operating Temperature ：-55℃~+125℃（Include 40℃ temperature rise） Relative Humidity ：40℃，90-95% Air pressure ：40KPa Vibration：10~500Hz， 100m/s² Shock： Acceleration300m/ s² Mian Technical Parameters Rated Current：3A（20℃） Contact Resistance：≤25mΩ lnsulation Resistance：≥1000MΩ Voltage Rating ：300V AC Withstand Voltage：750V Mechanical Life：500 times Insertion Force Per Pin ≤2N withdraw force Per PIN≥1.2N Part Number System

Key Features

• Material: Insulator: High temperature resistant thermoplastic, UL94-V0, black;
• Terminal: High performance copper alloy, contact area gold-plated, pins misted with tin;
• Fixed feet: High performance copper alloy, surface tin plated;
• Material: Insulator: High temperature resistant thermoplastic, UL94-V0, black;
• Terminal: High performance copper alloy, contact area gold-plated, pins misted with tin;

Applications

Server and AI compute power shelves, UPS and distributed power supplies, telecom and data centre equipment, energy storage systems, EV charging piles, solar inverters, industrial power distribution and medical instrumentation.